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MVU TM Plasma-PHT

Selective plasma etching of dielectric and metal films.

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MVU TM Plasma-PHT ICP

Selective (reactive-ion, anisotropic orientation dependent) plasma etching of dielectric and metal films.

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Etching of thin dielectric (SiO2, Si3N4) and metal layers (Mo, Cr, etc.), semiconductor materials (GaAs, Si, etc.) by plasma-reactive ion etching.

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Plasma chemical and reactive-ion etching of conducting and dielectric materials

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