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JSC "Research Institute of Precision Instruments"

The Research Institute of Precision Instruments (NIITM) is a daughter Company of “Sitronics. - Microelectronics Solutions”.

NIITM was established in 1962 to become a key enterprise of microelectronics industry with the main focus on specific processing equipment development. Since then it has designed over 250 types of vacuum plasma equipment and heat treatment machinery, which were sent into mass production. Over 3000 units manufactured under the Institute’s technology have formed the basis of Russian semiconductor production. Some of them were supplied to the CIS countries, Bulgaria, Poland, Germany, China and others.

In 1993 NIITM was reorganized into a joint stock company.

JSC NIITM is part of SITRONICS – Micro Electronics Solutions owned by JSC SITRONICS concern – a major high-technology company in Eastern Europe working in the field of telecommunications, IT, micro and nano electronics.

NIITM focuses on development of vacuum plasma equipment for deposition of thin films using magnetron sputtering and thermal evaporation techniques, plasma chemical etching and plasma-enhanced chemical vapour deposition methods, heat treatment machinery for diffusion, oxidation, epitaxy and annealing.

Priority areas of work – development of innovate technology equipment for micro, nano and radio electronics, micromechanics, nano material synthesis and other fields.

The Institute designs and manufactures experimental and trial equipment for scientific research and training of researchers and students and for low quantity production at medium and small businesses.

Profile

Engineering, manufacturing, up-grading and service of basic technology processing equipment for micro, nano and radio electronics, micromechanics, nano material synthesis and other areas.

The equipment is designed for industrial, trial and experimental production, scientific research and training.

Main Types of Equipment

Vacuum machinery for:

  • Deposition of metal layers by magnetron and cathode sputtering methods, by electronic-beam and thermal evaporation techniques as well as by other methods;
  • Plasma chemical and ion plasma etching of materials and plates, including polycrystalline diamond materials, using induction, capacitive and other types of plasma;
  • Chemical vapour deposition of dielectric, nano carbon, diamond and nano diamond layers;
  • Growing carbon nano tubes using plasma-enhanced chemical vapour deposition technique;
  • Material synthesis using plasma-enhanced high temperature treatment in the induction heating reactor.

Heat treatment machinery for:

  • Semiconductor plates diffusion, oxidation and annealing;
  • Silicon epitaxy and chemical vapour deposition of dielectric layers and polysilicon.

Parts Used

Domestically manufactured and imported vacuum tools (pumps, taps, controllers and others), high frequency and super high frequency generators, industrial controllers and other tools.

NIITM is interested in:

  • Innovative projects including state-private and international co-operation;
  • Supplying equipment and technology to industrial enterprises, scientific institutes of the Russian Academy of Sciences, industry-related and technical higher education institutions;
  • Long-term contracts to supply machinery and equipment parts.

Izophase TM 200

High frequency plasma-enhanced chemical vapour deposition of conducting and dielectric materials (SiO2, Si3N4, Si, SiC)

Izoplaz TM

Plasma-enhanced chemical vapour deposition of dielectric doped and non-doped silicon dioxide (SiO2) and silicon nitrate (Si3N4) at low pressure

Izotron TM

Low temperature chemical vapour deposition, including CVD of doped and non-doped silicon dioxide layers with the use of concentrated reagents at low pressure (fore-vacuum)

Magna TM 200

Magnetron sputtering deposition of multilayer or multi-component metal and dielectric coatings

MVU TM Izophase CVD

Deposition of dielectric layers (SiO2, Si3N4) from the gas phase with a plasma activation in RF discharge with RF diode sputtering system.

MVU TM Izophase CVD ICP

Deposition of dielectric layers (SiO2, Si3N4) from the gas phase with a plasma activation in RF discharge with inductively coupled plasma ICP source

MVU TM Magna

Deposition of metal films (AI, Ni, Fe, W, etc.) and dielectric (SiO2, Si3N4, etc.) by magnetron sputtering.

MVU TM Otjig

Heat treatment and drying of materials, layers and structures machine

MVU TM Plasma-PHT

Selective plasma etching of dielectric and metal films.

MVU TM Plasma-PHT ICP

Selective (reactive-ion, anisotropic orientation dependent) plasma etching of dielectric and metal films.

MVU TM RIT

Etching of thin dielectric (SiO2, Si3N4) and metal layers (Mo, Cr, etc.), semiconductor materials (GaAs, Si, etc.) by plasma-reactive ion etching.

MVU TM TIS

Metal film deposition by vacuum chemical vapor deposition

Otjig TM-2

Computerized thermal processing of plates and materials in high vacuum and gas – annealing, drying, drive-in diffusion, crystal structure rebuilding

Oxid TM

Computerized thermal treatment of plates and materials (diffusion, oxidation, annealing, drying, drive-in diffusion, crystal structure rebuilding) in controlled working gas environment at normal atmospheric pressure

Plasma TM 200

Plasma chemical and reactive-ion etching of conducting and dielectric materials

Vacuum coating unit

Vacuum coating machine with arc-plasma generator for metal, oxide and nitride functional coatings with increased physical and technical properties on metals and plastics.

Vacuum precision plasma etching

Vacuum plasma etching machine for ensuring of semiconductor structure etching characteristics required in micro- and nanoelectronics production process, and sufficient to implement the microelectromechanical system production process flow

Made in Zelenograd

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