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Telecom-STV

124498, Russia, Moscow, Zelenograd, passage 4806, Building 5/23

telecom-stv@made-in-zelenograd.com

Mirror-polished silicon wafers

ParameterValue
Diameter, mm15010076.250.8
Diameter tolerance, mm (standard/minimum)0.2/0.10.5/0.10.5/0.10.4/0.1
Thickness, m (standard/minimum)675/350525/300380/200275/150
Thickness tolerance, m (standard/minimum)15/5
TTV, m (standard/minimum) not more10/210/210/110/5
Warp, m (standard/minimum) not more40/1040/1030/530/5
Front side particles, (0.3 m) not more10555
Flats as per SEMI or customer's order

As-lapped silicon wafers for descrete device

ParameterValue
Diameter, mm34425063.576.2100150
Minimum thickness, m150150150150200200200
Thickness tolerance, m10101010101212
TTV (std/min), m not more2/1
Warp (std/min), m not more15/1215/1215/1220/1230/1535/2035/20

Custom processing

Thermal Oxide, LTO (Low Temperature Oxide), PSG (Phosphorous Doped Oxide), TEOS Oxide, Plasma Oxide, Plasma Nitride, LPCVD Silicon Nitride, Polysilicon, Photolithography, Photoresist Coating, and other...

Custom services

Auto-Sort Capabilities for Type, Resistivity, Thickness and Flatness, Epitaxial Layers, Ingot Slicing

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